Will Samsung and Qualcomm’s organic bridge technology make AI processors more powerful and cheaper to produce?

A collaboration between Samsung and Qualcomm aims to harness 'organic bridge' technology to reduce costs for AI CPUs The process is being developed for 2.1D packaging, a lower-cost integration than 2.5D , where silicon, glass, or ceramic materials are used Resins and composites are among the organic materials typically used in semiconductor integration Samsung and Qualcomm have collaborated on a new type of CPU that takes advantage of organic materials for integration between layers, rather than silicon or its alternatives.

Described as an “organic bridge,” the technology is intended for AI semiconductors.

The development of what has been named 2.1D packaging is aimed at reducing costs in AI chip fabrication, where 2.5D packaging is typically used.

2.5D chips rely on silicon, glass, or ceramic for connectivity between layers of microcircuits.

With 2.1D, however, the use of organic material improves bandwidth.

The organic bridge The key element of the 2.1D packaging is the organic bridge.

It’s a technology adopted (and shrunk down) from PCB manufacture, and can reduce reduce production costs while boosting assembly.

In short, it is a mass producer’s dream.

Rather than the silicon (or an inorganic alternative), the organic bridge is a layer cut from resin or polymer.

Its purpose is to connect multiple microcircuit dies, while providing insulation, as with silicon.

However, the organic bridge has been proved to be more efficient, and can be produced more easily at scale.

In addition, the organic bridge solves the supply chain issues surrounding silicon.

Development of the technology for die fabrication appears to have commenced around October 2024, when a patent for “interconnected bridge” technology was filed.

With the drive towards increased AI data centers in full swing, the 2.1D processor packaging could prove pivotal in delivering the predicted benefits of artificial intelligence.