AMD FPGA and Micron memory found in Russia's Iskander-1000 ballistic missile, Ukraine Intelligence claims — but stopping illegal trade is nearly impossible
HUR identified 140 components linked to the upgraded Iskander missile system American manufacturers supplied 63 of the missile's identified electronic components Only one-quarter of all components came from Russian domestic manufacturers Ukraine’s Defense Intelligence (HUR) has released details about foreign-made parts it says were found inside Russia’s upgraded Iskander-1000 ballistic missile.
The disclosure said American companies, including Xilinx, part of AMD, Atmel, part of Micron Technology, DM&P Electronics, Winbond Electronics, and Analog Devices, supplied critical parts for the missile's guidance and processing systems.
The agency also identified 140 components linked to the missile and said only a limited share came from Russian manufacturers.
Foreign chips remain inside Russia’s upgraded missile system The disclosure points to continued foreign technology use in a weapon system developed by Moscow despite efforts to reduce outside dependence.
According to Ukrainian intelligence, 35 companies are connected to the production network supporting Russia’s Iskander-M missile family.
The agency said the updated 9M723-2 variant, also called Iskander-1000, has appeared during recent attacks and forms part of the Bora-M missile system.
The newer missile version reportedly uses a larger engine and modified launcher design, allowing it to reach distances of up to 550km.
This compares with the 390km range attributed by Ukrainian intelligence to the earlier 9M723-1 missile model.
HUR stated that Russia continues to use imported electronic parts in key missile areas despite attempts to replace foreign technology with domestic alternatives.
The agency said only about one-quarter of the identified components were produced by Russian firms.
The intelligence report lists 63 components linked to manufacturers from the United States, while Switzerland and Belarus each account for eight components.
Germany and Taiwan were each linked to four parts, while China supplied three components according to the information released by HUR.
“The most critical components—microprocessors, FPGAs, memory, digital-to-analog and analog-to-digital converters—come from American and Taiwanese manufacturers…” said Ukraine’s Defense Intelligence.
The missile’s guidance system was described as one of the areas with significant foreign dependence.
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